US Patent No. 10,973,142

HERMETICALLY SEALED PRINTED CIRCUIT BOARDS


Patent No. 10,973,142
Issue Date April 06, 2021
Title Hermetically Sealed Printed Circuit Boards
Inventorship Anthony Sgroi, Jr., Wallingford, CT (US)
Assignee COVIDIEN LP, Mansfield, MA (US)

Claim of US Patent No. 10,973,142

1. A hermetically sealed printed circuit board assembly comprising:a printed circuit board including one or more electronic components disposed on a first side thereof; and
a cap including a wall having a first end portion and a second end portion, the first end portion including a flange defining one or more openings therein corresponding to the one or more electronic components of the printed circuit board, the flange bonded to the printed circuit board such that the one or more electronic components extend through the one or more openings of the flange, the wall extending from the flange and forming a continuous perimeter around the one or more electronic components, the second end portion of the wall sealed to form a hermetic chamber around the one or more electronic components.