US Patent No. 10,973,140


Patent No. 10,973,140
Issue Date April 06, 2021
Title Method For Assembling A Printed Circuit Board Assembly
Inventorship Lendon L. Bendix, Deland, FL (US)
Derek Turner, Winter Park, FL (US)
Assignee Sparton Corporation, Schaumburg, MI (US)

Claim of US Patent No. 10,973,140

1. A method for assembling a printed circuit board assembly (PCBA) for controlling an electrically-initiated device (EID) external to the PCBA and exposed to a broadband electric field, the method comprising:assembling a plurality of conductive layers configured to electrically connect to the EID, the plurality of conductive layers including at least one conductive layer in which an electrical current is impressed by the broadband electric field falling incident upon the at least one conductive layer;
positioning a dielectric layer between the plurality of conductive layers to form a stack-up;
connecting the plurality of conductive layers with a via; and
embedding a trans-conductor layer (TCL) between one of the conductive layers and the dielectric layer, the TCL including a nickel-metal composite metamaterial and having a variable geometry along a width and a length of the TCL, the TCL being configured to change shape, size, surface roughness and/or characteristic impedance in the presence of the broadband electric field to thereby redirect the impressed electrical current away from the conductive layers and into the dielectric layer,
wherein the dielectric layer is configured as a dielectric waveguide that redirects field energy of the electrical current to at least one end of the PCBA and into the via, the via being configured to radiate the field energy away from the EID.