US Patent No. 10,973,132

RADIO-FREQUENCY MODULE AND COMMUNICATION APPARATUS


Patent No. 10,973,132
Issue Date April 06, 2021
Title Radio-frequency Module And Communication Apparatus
Inventorship Hironori Chikita, Kyoto (JP)
Assignee MURATA MANUFACTURING CO., LTD., Kyoto (JP)

Claim of US Patent No. 10,973,132

1. A radio-frequency module comprising:a switch integrated circuit comprising a first main face and an opposing second main face, a first connection electrode arranged on the first main face, and a second connection electrode arranged on the second main face;
at least one mounting substrate in or on which the switch integrated circuit is mounted, and that comprises a first mounting face at the first main face side, and a second mounting face at the second main face side;
a first signal line at the first mounting face side of the at least one mounting substrate, the first signal line being connected to the first connection electrode and configured to transmit a radio-frequency signal in a first frequency band;
a second signal line at the second mounting face side of the at least one mounting substrate, the second signal line being connected to the second connection electrode and configured to transmit a radio-frequency signal in a second frequency band, the second frequency band being different than the first frequency band;
a first electronic component connected to the first signal line; and
a second electronic component connected to the second signal line,
wherein the first electronic component, but not the second electronic component, is mounted on the first mounting face, and
wherein the second electronic component, but not the first electronic component, is mounted on the second mounting face.