US Patent No. 10,973,131

METHOD OF MANUFACTURING PRINTED CIRCUIT BOARDS


Patent No. 10,973,131
Issue Date April 06, 2021
Title Method Of Manufacturing Printed Circuit Boards
Inventorship Joseph Kuczynski, North Port, FL (US)
Sarah K. Czaplewski-Campbell, Rochester, MN (US)
Timothy J. Tofil, Rochester, MN (US)
Eric J. Campbell, Rochester, MN (US)
Assignee International Business Machines Corporation, Armonk, NY (US)

Claim of US Patent No. 10,973,131

1. A method of forming a stub-less via, comprising:depositing a plurality of microcapsules containing a metal material in a via of a printed circuit board (PCB);
rupturing the microcapsules and releasing the metal material; and
sintering the released metal material.