US Patent No. 10,973,130


Patent No. 10,973,130
Issue Date April 06, 2021
Title Printed Wiring Board
Inventorship Shinichirou Hayashi, Yamanashi-ken (JP)
Assignee FANUC CORPORATION, Yamanashi (JP)

Claim of US Patent No. 10,973,130

8. A printed wiring board comprising:a substrate;
a contact member arranged in contact with the substrate; and
a wear resistant member fixed at least in an area on the substrate that comes in contact with the contact member, the wear resistant member having a wear resistance higher than that of the substrate, to prevent the substrate from wearing due to the contact member contacting and rubbing against the substrate,
wherein the contact member is a support part configured to support an electronic component mounted on the substrate, and
the contact member contacts the wear resistant member in a manner that the contact member may rub against the wear resistant member.