US Patent No. 10,973,120

INSULATING FILM AND PRINTED CIRCUIT BOARD INCLUDING THE SAME


Patent No. 10,973,120
Issue Date April 06, 2021
Title Insulating Film And Printed Circuit Board Including The Same
Inventorship Junghyun Lee, Suwon-si (KR)
Changhyun Yoon, Suwon-si (KR)
Seong-Chan Park, Suwon-si (KR)
Choonkeun Lee, Suwon-si (KR)
Youngju Lee, Suwon-si (KR)
Assignee SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)

Claim of US Patent No. 10,973,120

1. An insulating film comprising:an insulating layer; and
a surface bonding layer disposed on the insulating layer,
wherein the surface bonding layer includes a radical generation element and a coordinate bond element, and
in the surface bonding layer, a/b is 0.05 or more and 0.35 or less, in which ‘a’ is an atom content of the coordinate bond element and ‘b’ is an atom content of the radical generation element.