US Patent No. 10,973,116

3D HIGH-INDUCTIVE GROUND PLANE FOR CROSSTALK REDUCTION


Patent No. 10,973,116
Issue Date April 06, 2021
Title 3d High-inductive Ground Plane For Crosstalk Reduction
Inventorship Jackson Chung Peng Kong, Tanjung Tokong (MY)
Bok Eng Cheah, Bayan Lepas (MY)
Khang Choong Yong, Puchong (MY)
Ramaswamy Parthasarathy, Bangalore (IN)
Assignee Intel Corporation, Santa Clara, CA (US)

Claim of US Patent No. 10,973,116

1. A printed circuit board comprising:a first signal trace and a second signal trace on a first layer, wherein the first signal trace and second signal trace are non-intersecting, and the first signal trace and second signal trace are along a direction, and wherein the first signal trace is not coupled to the second signal trace;
a second layer below the first layer;
a third layer below the second layer; and
a three-dimensional (3D) ground plane, the 3D ground plane including:
a first plurality of segments on the third layer, a second plurality of segments on the second layer, and a plurality of metal vias to connect the first plurality of segments and the second plurality of segments in the 3D ground plane, wherein the first plurality of segments and the second plurality of segments are along the direction, and wherein the first plurality of segments and the second plurality of segments are between and non-overlapping with the first signal trace and the second signal trace from a plan view perspective.