1. A method, comprising forming a solid indium-based interface between a first surface and a second surface by:first positioning a first side of an indium-based material in contact with the first surface while heating the indium-based material above the melting point of the indium-based material, and forming at least one bump on an opposing second side of the indium-based material, the bump having an outer surface that extends outward and away from the second side of the indium-based material;
then maintaining the indium-based material in contact with the first surface while allowing the indium-based material to cool below the melting point of the indium-based material;
then positioning the outer surface of the bump in contact with the second surface while again heating the indium-based material above the melting point of the indium-based material to melt the bump into a raised contact having an outer surface that extends outward and away from the second side of the indium-based material in contact with the second surface; and
then maintaining the second surface in contact with the outer surface of the raised contact while allowing the indium-based material to cool below the melting point of the indium-based material to form a solid indium-based interface that is mechanically adhered without the presence of solder to the first surface and to the second surface with a height of the raised contact forming a gap between the second surface and the second side of the indium-based material.