US Patent No. 10,973,114

INDIUM-BASED INTERFACE STRUCTURES, APPARATUS, AND METHODS FOR FORMING THE SAME


Patent No. 10,973,114
Issue Date April 06, 2021
Title Indium-based Interface Structures, Apparatus, And Methods For Forming The Same
Inventorship Matthew J. Spitzner, Lowry Crossing, TX (US)
Fernando Ortiz, Dallas, TX (US)
Assignee L3 Technologies, Inc., New York, NY (US)

Claim of US Patent No. 10,973,114

1. A method, comprising forming a solid indium-based interface between a first surface and a second surface by:first positioning a first side of an indium-based material in contact with the first surface while heating the indium-based material above the melting point of the indium-based material, and forming at least one bump on an opposing second side of the indium-based material, the bump having an outer surface that extends outward and away from the second side of the indium-based material;
then maintaining the indium-based material in contact with the first surface while allowing the indium-based material to cool below the melting point of the indium-based material;
then positioning the outer surface of the bump in contact with the second surface while again heating the indium-based material above the melting point of the indium-based material to melt the bump into a raised contact having an outer surface that extends outward and away from the second side of the indium-based material in contact with the second surface; and
then maintaining the second surface in contact with the outer surface of the raised contact while allowing the indium-based material to cool below the melting point of the indium-based material to form a solid indium-based interface that is mechanically adhered without the presence of solder to the first surface and to the second surface with a height of the raised contact forming a gap between the second surface and the second side of the indium-based material.