1. A component carrier, comprising:a stack comprising a plurality of electrically conductive layer structures and/or electrically insulating layer structures;
a first transistor component and a second transistor component embedded side-by-side along a direction of main extension of the component carrier in the stack;
wherein the first transistor component and the second transistor component are embedded at the same vertical level within a central core layer of the stack, and wherein the central core layer comprises a thickness that is larger than the thickness of the first transistor and is larger than the thickness of the second transistor;
at least one control chip configured for controlling at least one of the first transistor component and the second transistor component,
wherein the at least one control chip is surface mounted on the stack; and
at least one temperature sensor component embedded in the stack for sensing information indicative of a temperature in the stack;
wherein the at least one temperature sensor component is embedded in an electrically insulating layer structure which comprises at least one of the group consisting of resin, reinforced or non-reinforced resin, epoxy resin or Bismaleimide-Triazine resin, FR-4, FR-5, cyanate ester, polyphenylene derivate, prepreg material, polyimide, polyamide, liquid-crystal polymer, epoxy-based Build-Up Film, polytetrafluoroethylene;
wherein the component carrier is configured for reducing power or switching off at least one of the first transistor component and the second transistor component when information sensed by the at least one temperature sensor component indicates overheating.