US Patent No. 10,925,199

COMPONENT MOUNTER


Patent No. 10,925,199
Issue Date February 16, 2021
Title Component Mounter
Inventorship Mizuho Nozawa, Nukata-gun (JP)
Assignee FUJI CORPORATION, Chiryu (JP)

Claim of US Patent No. 10,925,199

1. A component mounter configured to hold a component and mount the component on a surface of a board, the component mounter comprising:a head having a nozzle configured to hold the component at a nozzle tip of the nozzle;
a horizontal moving device configured to move the head in a horizontal direction with respect to the surface of the board;
a vertical moving device configured to move the nozzle in a vertical direction with respect to the surface of the board, the nozzle oriented in the vertical direction;
a mounting control device configured to perform mounting operation of mounting the component held by the nozzle at a mounting position on the surface of the board by moving the head using the horizontal moving device such that the nozzle is positioned above the mounting position on the surface of the board and lowering the nozzle using the vertical moving device; and
an imaging device provided on the head and configured to image an imaging target by receiving incident light from the imaging target on an imaging element via an optical system,
wherein
the optical system includes:
an upper incident opening formed at a position facing a base section of the nozzle positioned at the mounting position,
a lateral incident opening formed at a position lower than and horizontally from the upper incident opening,
a first optical system configured to guide incident light entering the lateral incident opening from a direction of a side surface of the nozzle tip to a first region of the imaging element, the side surface being viewable in the horizontal direction, and
a second optical system configured to guide incident light entering the upper incident opening from a direction of the surface of the board to a second region of the imaging element in a state with the nozzle above the surface of the board,
the imaging device is configured to be able to image an image of the side surface of the nozzle tip and an image of the surface of the board respectively via the first optical system and the second optical system, and
the optical system includes a left mirror, a right mirror, a middle mirror arranged between the left mirror and the right mirror, an upper mirror arranged at the upper incident opening, a first rear mirror arranged rearward of the middle mirror and the upper mirror, and a second rear mirror arranged above the first rear mirror.