1. A server assembly, comprising:an enclosure having a first wall, a second wall spaced apart from and opposite the first wall, and multiple sidewalls between the first wall and the second wall, the first wall, the second wall, and the sidewalls surrounding an interior space;
a server blade having a printed circuit board (PCB) mounted on a portion of the second wall, the PCB carrying one or more heat producing components;
a dielectric coolant in the interior space of the enclosure and submerging the heat producing components on the PCB; and
a condenser assembly in the interior space of the enclosure, the condenser assembly having:
a housing having a vapor inlet and a liquid outlet proximate the PCB of the server blade;
a condenser coil in the housing, the condenser coil being in fluid communication with a vapor gap in the interior space via the vapor inlet, the condenser coil being configured to receive a coolant that removes heat from a vapor of the dielectric coolant in the vapor gap, thereby condensing the vapor into a liquid form to be returned to the heat producing components mounted on the PCB via the liquid outlet.