US Patent No. 10,925,177

HEAT DISSIPATION IN AN ELECTRONIC CIRCUIT AND METHOD


Patent No. 10,925,177
Issue Date February 16, 2021
Title Heat Dissipation In An Electronic Circuit And Method
Inventorship Ulrich Hansen, Stolberg (DE)
Assignee Comet AG, Flamatt (CH)

Claim of US Patent No. 10,925,177

1. An electronic circuitry module, comprising:a housing comprising a base plate and one or more sidewalls connected to and extending around the base plate to form an enclosure;
at least one electronic circuit comprising at least one heat generating electronic component disposed within the enclosure and mounted on the base plate, the at least one heat generating component comprising at least one power transformer;
a cooling circuit disposed within the enclosure and including an inlet and an outlet for flow of cooling liquid therebetween; and
a potting material that conforms to the housing and substantially fills the enclosure to submerse the at least one electronic circuit and the cooling circuit,
wherein the at least one electronic circuit includes a first printed circuit board and a second printed circuit board that are stacked with respect to each other and occupy different levels, and wherein the potting material fills a space between the first printed circuit board and the second printed circuit board.