US Patent No. 10,925,171

SURFACE TREATED COPPER FOIL, SURFACE TREATED COPPER FOIL WITH RESIN LAYER, COPPER FOIL WITH CARRIER, LAMINATE, METHOD FOR MANUFACTURING PRINTED WIRING BOARD, HEAT DISSIPATION SUBSTRATE, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE


Patent No. 10,925,171
Issue Date February 16, 2021
Title Surface Treated Copper Foil, Surface Treated Copper Foil With Resin Layer, Copper Foil With Carrier, Laminate, Method For Manufacturing Printed Wiring Board, Heat Dissipation Substrate, And Method For Manufacturing Electronic Device
Inventorship Yuki Ori, Ibaraki (JP)
Hideta Arai, Ibaraki (JP)
Atsushi Miki, Ibaraki (JP)
Ryo Fukuchi, Ibaraki (JP)
Assignee

Claim of US Patent No. 10,925,171

1. A surface treated copper foil, comprisinga copper foil, and
a roughening treatment layer on at least one surface of the copper foil,
wherein a surface of the side of the roughening treatment layer of the surface treated copper foil satisfies one or more selected from the following items (1-1) to (1-3) and
(1-1) a roughness Sq is 0.16 to 0.30 ?m,
(1-2) a roughness Ssk is ?0.6 to ?0.35,
(1-3) a roughness Sa is 0.12 to 0.23 ?m,
a glossiness of a TD of the surface of the side of the roughening treatment layer of the surface treated copper foil is 70% or less.