US Patent No. 10,925,170

SURFACE TREATED COPPER FOIL, SURFACE TREATED COPPER FOIL WITH RESIN LAYER, COPPER FOIL WITH CARRIER, LAMINATE, METHOD FOR MANUFACTURING PRINTED WIRING BOARD, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE


Patent No. 10,925,170
Issue Date February 16, 2021
Title Surface Treated Copper Foil, Surface Treated Copper Foil With Resin Layer, Copper Foil With Carrier, Laminate, Method For Manufacturing Printed Wiring Board, And Method For Manufacturing Electronic Device
Inventorship Yuki Ori, Ibaraki (JP)
Hideta Arai, Ibaraki (JP)
Atsushi Miki, Ibaraki (JP)
Ryo Fukuchi, Ibaraki (JP)
Assignee

Claim of US Patent No. 10,925,170

1. A surface treated copper foil, comprisinga copper foil, and
a roughening treatment layer on at least one surface of the copper foil,
wherein an aspect ratio of roughening particles of the roughening treatment layer satisfies one or more of the following items (1) and (2), the aspect ratio being a height of the roughening particles/a thickness of the roughening particles:(1) the aspect ratio of the roughening particles is 3 or less and the height of the roughening particles is 1943 nm or less,(2) the aspect ratio of the roughening particles satisfies any one of the following items (2-1) or (2-2):(2-1) the aspect ratio of the roughening particles is 10 or less in the case that the height of the roughening particles is more than 500 nm and 1000 nm or less, (2-2) the aspect ratio of the roughening particles is 15 or less in the case that the height of the roughening particles is 500 nm or less; anda glossiness of a TD of the surface of the side of the roughening treatment layer of the surface treated copper foil is 70% or less.