US Patent No. 10,925,165

COMPONENT CARRIER WITH ADHESION PROMOTING SHAPE OF WIRING STRUCTURE


Patent No. 10,925,165
Issue Date February 16, 2021
Title Component Carrier With Adhesion Promoting Shape Of Wiring Structure
Inventorship Hannes Voraberger, Graz (AT)
Assignee

Claim of US Patent No. 10,925,165

1. A component carrier, comprising:a base structure; and
an electrically conductive wiring structure on the base structure;
wherein the wiring structure has a nonrectangular cross-sectional shape configured so that an adhesion promoting constriction is formed by at least one of the group consisting of the wiring structure and a transition between the base structure and the wiring structure,
wherein the adhesion promoting constriction is formed by a double trapezoidal cross-section of the wiring structure with narrow ends of both trapezoids facing each another, wherein the side walls of the wiring structure are not curved;
wherein the wiring structure has a first horizontal extension at a contact position with the base structure, has a second horizontal extension at an end position opposing the contact position, and has a third horizontal extension at an intermediate position between the contact position and the end position, wherein the third horizontal extension is smaller than the first horizontal extension and is smaller than the second horizontal extension, and
wherein the component carrier comprises at least one of the group consisting of resin, Epoxy resin, Bismaleimide-Triazine resin, cyanate ester, prepreg material, polyimide, polyamide, polytetrafluoroethylene, liquid crystal polymer, epoxy-based Build-Up Film, FR4 material, FR5 material.