US Patent No. 10,925,162

PRINTED CIRCUIT BOARD


Patent No. 10,925,162
Issue Date February 16, 2021
Title Printed Circuit Board
Inventorship Cheng Fu Hsu, New Taipei (TW)
Cheng Wei Lin, New Taipei (TW)
Ting-Kai Wang, New Taipei (TW)
Assignee Wiwynn Corporation, New Taipei (TW)

Claim of US Patent No. 10,925,162

1. A printed circuit board comprising:N power layers, arranged in parallel and spaced from each other; and
a first via group, comprising M rows of vias which are disposed through the N power layers, where N and M are positive integers greater than 0,
wherein each row of the M rows of vias is electrically connected to a first layer of the N power layers, and a Pth row of the M rows of vias is disposed through all power layers, but only directly contacts Q power layers of the N power layers respectively, where Q is a smallest positive integer greater than or equal to P((N?1)/M), and P is a positive integer less than or equal to M.