US Patent No. 10,925,162


Patent No. 10,925,162
Issue Date February 16, 2021
Title Printed Circuit Board
Inventorship Cheng Fu Hsu, New Taipei (TW)
Cheng Wei Lin, New Taipei (TW)
Ting-Kai Wang, New Taipei (TW)
Assignee Wiwynn Corporation, New Taipei (TW)

Claim of US Patent No. 10,925,162

1. A printed circuit board comprising:N power layers, arranged in parallel and spaced from each other; and
a first via group, comprising M rows of vias which are disposed through the N power layers, where N and M are positive integers greater than 0,
wherein each row of the M rows of vias is electrically connected to a first layer of the N power layers, and a Pth row of the M rows of vias is disposed through all power layers, but only directly contacts Q power layers of the N power layers respectively, where Q is a smallest positive integer greater than or equal to P((N?1)/M), and P is a positive integer less than or equal to M.