US Patent No. 10,925,158

FLEXIBLE SUBSTRATE


Patent No. 10,925,158
Issue Date February 16, 2021
Title Flexible Substrate
Inventorship Yoshihiro Tomita, Osaka (JP)
Assignee Panasonic Intellectual Property Management Co., Ltd., Osaka (JP)

Claim of US Patent No. 10,925,158

1. A flexible substrate comprising:a plurality of unit wiring structures; and
a plurality of electronic elements each disposed on a central section of a corresponding one of the plurality of unit wiring structures, wherein
each of the plurality of unit wiring structures includes:
the central section; and
at least four curved strips that are disposed at an outer side of the central section, each of the curved strips having a first end connected to the central section,
the central section includes:
an insulation layer;
an interlayer connection via that passes through the insulation layer;
a first wiring connected to the interlayer connection via; and
a second wiring electrically connected to the first wiring by way of the interlayer connection via,
the first wiring, the insulation layer and the second wiring are disposed in this order,
two of the at least four curved strips extending in a first direction are connected to the first wiring, other two of the at least four curved strips extending in a second direction are connected to the second wiring,
the second wiring has a first part and a second part separated from the first part, and
each of the first part and the second part is electrically connected to the electronic element.