US Patent No. 10,925,153

SYSTEM AND METHOD TO PROVIDE CONNECTION PADS FOR HIGH SPEED CABLES


Patent No. 10,925,153
Issue Date February 16, 2021
Title System And Method To Provide Connection Pads For High Speed Cables
Inventorship Sandor Farkas, Round Rock, TX (US)
Bhyrav M. Mutnury, Austin, TX (US)
Assignee Dell Products, L.P., Round Rock, TX (US)

Claim of US Patent No. 10,925,153

1. A printed circuit board, comprising:first and second signal wire bond pads; and
first, second, and third ground wire bond pads, wherein the first and second signal wire bond pads and the first and second ground wire bond pads are arranged in a line with the first and second signal wire bond pads between the first and second ground wire bond pads, and wherein the third ground wire bond pad is arranged between the first and second signal wire bond pads but is not in line with the first and second signal wire bond pads, wherein the printed circuit board is arranged to couple a single-drain cable such that a first signal conductor of the single-drain cable is connected to the first signal wire bond pad, a second signal conductor of the single-drain cable is connected to the second signal wire bond pad, and a ground conductor of the single-drain cable is connected to the third ground wire bond pad.