US Patent No. 10,925,152

DIELECTRIC COATING FOR CROSSTALK REDUCTION


Patent No. 10,925,152
Issue Date February 16, 2021
Title Dielectric Coating For Crosstalk Reduction
Inventorship Albert Sutono, Chandler, AZ (US)
Xiaoning Ye, Portland, OR (US)
Jimmy Hsu, Taoyuan (TW)
Daniel Hull, Chandler, AZ (US)
Assignee Intel Corporation, Santa Clara, CA (US)

Claim of US Patent No. 10,925,152

1. A printed circuit board (PCB), comprising:a substrate;
first and second microstrip conductors located on a surface of the substrate;
a solder mask covering the surface of the substrate and the first and second microstrip conductors; and
a dielectric coating disposed on the solder mask, on an opposite side of the solder mask from the first and second microstrip conductors, wherein a thickness of the dielectric coating is selected to provide a ratio of capacitive coupling to self capacitance for each of the first and second microstrip conductors to be approximately equal, within 25%, to a ratio of inductive coupling to self inductance for each of the first and second microstrip conductors.