1. A method for providing a Printed Wiring Board (PWB) designed to reduce cross talk associated with a high speed electrical connector, comprising:forming a core substrate comprising a plurality of laminated dielectric substrate layers with a first via formed therethrough;
disposing a first trace on an exposed surface of the core substrate that is in electrical contact with the first via;
laminating a first High Density Interconnect (HDI) substrate to the core substrate such that the first trace electrically connects the first via with a second via formed through the first HDI substrate;
disposing a second trace on an exposed surface of the first HDI substrate that is in electrical contact with the second via; and
laminating a second HDI substrate to the first HDI substrate such that the second trace electrically connects the second via to a third via formed through the second HDI substrate;
wherein the second via comprises a buried via with a central axis spatially offset from central axis of the first and third vias, and the first and second vias having diameters which are smaller than a diameter of the third via.