US Patent No. 10,925,151


Patent No. 10,925,151
Issue Date February 16, 2021
Title Systems And Methods For Providing A High Speed Interconnect System With Reduced Crosstalk
Inventorship Michael T. DeRoy, Melbourne, FL (US)
Marvin D. Miller, Palm Bay, FL (US)
Andres M. Gonzalez, Melbourne, FL (US)
David Cure, West Melbourne, FL (US)
Tena M. Hochard, Palm Bay, FL (US)
Assignee EAGLE TECHNOLOGY, LLC, Melbourne, FL (US)

Claim of US Patent No. 10,925,151

1. A method for providing a Printed Wiring Board (“PWB”) designed to reduce cross talk associated with a high speed electrical connector, comprising:forming a core substrate comprising a plurality of laminated dielectric substrate layers with a first via formed therethrough;
disposing a first trace on an exposed surface of the core substrate that is in electrical contact with the first via;
laminating a first High Density Interconnect (“HDI”) substrate to the core substrate such that the first trace electrically connects the first via with a second via formed through the first HDI substrate;
disposing a second trace on an exposed surface of the first HDI substrate that is in electrical contact with the second via; and
laminating a second HDI substrate to the first HDI substrate such that the second trace electrically connects the second via to a third via formed through the second HDI substrate;
wherein the second via comprises a buried via with a central axis spatially offset from central axis of the first and third vias, and the first and second vias having diameters which are smaller than a diameter of the third via.