US Patent No. 10,925,150

ANTI-PAD FOR A PRINTED CIRCUIT BOARD


Patent No. 10,925,150
Issue Date February 16, 2021
Title Anti-pad For A Printed Circuit Board
Inventorship Bin Lin, Hummelstown, PA (US)
Bernard Wilhelm Vetten, Sunnyvale, CA (US)
Eric DiBiaso, Lebanon, PA (US)
Assignee TE CONNECTIVITY CORPORATION, Berwyn, PA (US)

Claim of US Patent No. 10,925,150

1. A printed circuit board comprising:a substrate having a plurality of stacked circuit board layers, the substrate having a top surface and a bottom surface;
a signal contact on the substrate, the signal contact having a signal via and a signal trace extending from the signal via, the signal via extending between the top surface and the bottom surface along a via axis; and
an anti-pad around the signal via extending through the substrate along the via axis, the anti-pad extending between the top surface and the bottom surface, the anti-pad having a first width at the top surface, the anti-pad having a second width at the bottom surface different than the first width, the anti-pad including an upper anti-pad at the top surface having the first width, a lower anti-pad at the bottom surface having the second width, and an intermediate anti-pad between the upper anti-pad and the lower anti-pad, the intermediate anti-pad having a third width different than the first width and different than the second width, the upper anti-pad comprising at least two of the circuit board layers, the lower anti-pad comprising at least two of the circuit board layers, the intermediate anti-pad comprising at least two of the circuit board layers.