US Patent No. 10,920,310

REACTIVE SPUTTER DEPOSITION OF DIELECTRIC FILMS


Patent No. 10,920,310
Issue Date February 16, 2021
Title Reactive Sputter Deposition Of Dielectric Films
Inventorship Georg J. Ockenfuss, Santa Rosa, CA (US)
Assignee VIAVI Solutions Inc., San Jose, CA (US)

Claim of US Patent No. 10,920,310

1. A system comprising:a chamber;
a multi-substrate holder to rotate about a vertical axis within the chamber and simultaneously deposits coating onto a plurality of substrates;
a pair of inlets, connected to a reservoir, to feed a first portion of a mixture of a reactive gas and water vapor into the chamber;
a pair of ring cathode targets,
wherein an inlet, of the pair of inlets, is disposed at a center of a ring cathode target of the pair of ring cathode targets; and
an anode to add a second portion of the mixture of the reactive gas and the water vapor to the chamber,
wherein the anode is positioned separately from the pair of ring cathode targets.