US Patent No. 10,920,027
EPOXY RESIN COMPOSITION, MOLDING MATERIAL, AND FIBER-REINFORCED COMPOSITE MATERIAL
| Patent No. | 10,920,027 |
|---|---|
| Issue Date | February 16, 2021 |
| Title | Epoxy Resin Composition, Molding Material, And Fiber-reinforced Composite Material |
| Inventorship | Akira Oota, Tokyo (JP) Masahiro Ichino, Tokyo (JP) Takuya Teranishi, Tokyo (JP) Mitsuru Kutsuwada, Tokyo (JP) Yusuke Watanabe, Yokkaichi (JP) Natsumi Mukouzaka, Yokkaichi (JP) |
| Assignee | Mitsubishi Chemical Corporation, Chiyoda-ku (JP) |
Claim of US Patent No. 10,920,027
1. A molding material, comprising:a thickened product of an epoxy resin composition; and
a reinforcing fiber;
wherein the epoxy resin composition comprises:
a component (A): an aromatic epoxy resin;
a component (B): an alicyclic diamine;
a component (C): an epoxy resin curing agent that is not an alicyclic diamine; and
a component (D): an aliphatic epoxy, resin,
wherein, when the viscosity at 25° C. immediately after preparation of the epoxy resin composition is taken as (a) and the viscosity at 25° C. after three hours from the preparation is taken as (b), the epoxy resin composition satisfies:
(a)=0.1 to 25 Pa·s;
(b)=0.1 to 25 Pa·s; and
(b)/(a)?5.
a reinforcing fiber;
wherein the epoxy resin composition comprises:
a component (A): an aromatic epoxy resin;
a component (B): an alicyclic diamine;
a component (C): an epoxy resin curing agent that is not an alicyclic diamine; and
a component (D): an aliphatic epoxy, resin,
wherein, when the viscosity at 25° C. immediately after preparation of the epoxy resin composition is taken as (a) and the viscosity at 25° C. after three hours from the preparation is taken as (b), the epoxy resin composition satisfies:
(a)=0.1 to 25 Pa·s;
(b)=0.1 to 25 Pa·s; and
(b)/(a)?5.