US Patent No. 10,920,027

EPOXY RESIN COMPOSITION, MOLDING MATERIAL, AND FIBER-REINFORCED COMPOSITE MATERIAL


Patent No. 10,920,027
Issue Date February 16, 2021
Title Epoxy Resin Composition, Molding Material, And Fiber-reinforced Composite Material
Inventorship Akira Oota, Tokyo (JP)
Masahiro Ichino, Tokyo (JP)
Takuya Teranishi, Tokyo (JP)
Mitsuru Kutsuwada, Tokyo (JP)
Yusuke Watanabe, Yokkaichi (JP)
Natsumi Mukouzaka, Yokkaichi (JP)
Assignee Mitsubishi Chemical Corporation, Chiyoda-ku (JP)

Claim of US Patent No. 10,920,027

1. A molding material, comprising:a thickened product of an epoxy resin composition; and
a reinforcing fiber;
wherein the epoxy resin composition comprises:
a component (A): an aromatic epoxy resin;
a component (B): an alicyclic diamine;
a component (C): an epoxy resin curing agent that is not an alicyclic diamine; and
a component (D): an aliphatic epoxy, resin,
wherein, when the viscosity at 25° C. immediately after preparation of the epoxy resin composition is taken as (a) and the viscosity at 25° C. after three hours from the preparation is taken as (b), the epoxy resin composition satisfies:
(a)=0.1 to 25 Pa·s;
(b)=0.1 to 25 Pa·s; and
(b)/(a)?5.