US Patent No. 10,893,635
HIGH FREQUENCY POWER CIRCUIT MODULE
| Patent No. | 10,893,635 |
|---|---|
| Issue Date | January 12, 2021 |
| Title | High Frequency Power Circuit Module |
| Inventorship | Tatsuya Hosotani, Nagaokakyo (JP) |
| Assignee | Murata Manufacturing Co., Ltd., Kyoto-fu (JP) |
Claim of US Patent No. 10,893,635
1. A high frequency power circuit module comprising:an electronic circuit substrate including a bending section;
a high frequency power circuit formed on the electronic circuit substrate;
a battery electrically connected to the high frequency power circuit; and
a magnetic material layer having a projected area larger than a projected area of the battery,
wherein the battery is covered with the magnetic material layer in a state in which the electronic circuit substrate is bent at the bending section,
the high frequency power circuit module further includes a material to fill a space between the high frequency power circuit and at least one of the battery and the magnetic material layer, and
the material has a thermal resistance lower than a thermal resistance of air, and thermally couples the high frequency power circuit and at least one of the battery and the magnetic material layer.
a high frequency power circuit formed on the electronic circuit substrate;
a battery electrically connected to the high frequency power circuit; and
a magnetic material layer having a projected area larger than a projected area of the battery,
wherein the battery is covered with the magnetic material layer in a state in which the electronic circuit substrate is bent at the bending section,
the high frequency power circuit module further includes a material to fill a space between the high frequency power circuit and at least one of the battery and the magnetic material layer, and
the material has a thermal resistance lower than a thermal resistance of air, and thermally couples the high frequency power circuit and at least one of the battery and the magnetic material layer.