US Patent No. 10,893,635

HIGH FREQUENCY POWER CIRCUIT MODULE


Patent No. 10,893,635
Issue Date January 12, 2021
Title High Frequency Power Circuit Module
Inventorship Tatsuya Hosotani, Nagaokakyo (JP)
Assignee Murata Manufacturing Co., Ltd., Kyoto-fu (JP)

Claim of US Patent No. 10,893,635

1. A high frequency power circuit module comprising:an electronic circuit substrate including a bending section;
a high frequency power circuit formed on the electronic circuit substrate;
a battery electrically connected to the high frequency power circuit; and
a magnetic material layer having a projected area larger than a projected area of the battery,
wherein the battery is covered with the magnetic material layer in a state in which the electronic circuit substrate is bent at the bending section,
the high frequency power circuit module further includes a material to fill a space between the high frequency power circuit and at least one of the battery and the magnetic material layer, and
the material has a thermal resistance lower than a thermal resistance of air, and thermally couples the high frequency power circuit and at least one of the battery and the magnetic material layer.