US Patent No. 10,893,631

LIQUID COOLING DEVICE COMBINED ON GRAPHICS CARD


Patent No. 10,893,631
Issue Date January 12, 2021
Title Liquid Cooling Device Combined On Graphics Card
Inventorship Shui-Fa Tsai, New Taipei (TW)
Assignee Cooler Master Co., Ltd., New Taipei (TW)

Claim of US Patent No. 10,893,631

1. A liquid cooling device, configured for heat source attachment, comprising:a heat dissipating assembly forming a first flow path, comprising:
a plate comprising:
a connecting surface, comprising:
a connecting portion, configured for heat source attachment; and
at least one groove, configured for accommodating electronic components protruding from an upper surface of a main body of a heat source; and
a sinking surface, opposite the connecting surface, comprising:
a plurality of fins corresponding to the connecting portion; and
a protrusion portion corresponding to the at least one groove; and
a cover, securely mounted on the sinking surface, comprising two separate stepping openings communicating with two separate passages, respectively,
wherein the two separate stepping openings correspond to the protrusion portion corresponding to the at least one groove, and the protrusion portion and two separate stepping openings form two separate flowing spaces, and
wherein the first flow path is formed between the plate and the cover, and flows through the intervals of the plurality of fins and two separate flowing spaces of the two separate stepping openings and two separate passages, respectively; and
a pump assembly forming a second flow path communicating with the first flow path via the two separate passages, respectively, securely mounted on the heat dissipating assembly and juxtaposing the heat dissipating assembly,
wherein the formation of the two separate flowing spaces increases a vertical height of the first flow path to the two separate passages communicating with the second flow path of the pump assembly, respectively, enlarging a vertical height of the pump assembly for housing of a larger pump assembly and permitting accommodation of the at least one groove, configured for accommodating electronic components protruding from the upper surface of the main body of the heat source.