US Patent No. 10,893,618

METHOD FOR MANUFACTURING MULTILAYER SUBSTRATE


Patent No. 10,893,618
Issue Date January 12, 2021
Title Method For Manufacturing Multilayer Substrate
Inventorship Kuniaki Yosui, Nagaokakyo (JP)
Naoki Gouchi, Nagaokakyo (JP)
Shingo Ito, Nagaokakyo (JP)
Assignee MURATA MANUFACTURING CO., LTD., Kyoto (JP)

Claim of US Patent No. 10,893,618

1. A method for manufacturing a multilayer substrate, comprising:forming a first conductor pattern by plating on a first surface of a first resin substrate more thickly than a second conductor pattern formed by plating on a second surface, opposite to the first surface, of the first resin substrate, forming a third conductor pattern by plating on a third surface, facing the second surface, of a second resin substrate, and forming a fourth conductor pattern by plating on a fourth surface, opposite to the third surface, of the second resin substrate; and
after forming the first to fourth conductor patterns by plating, laminating and thermocompression-bonding together a plurality of layers including the first resin substrate, the second resin substrate, and a bonding layer including no conductor pattern while holding the bonding layer between the second surface of the first resin substrate and the third surface of the second resin substrate, and locating the first conductor pattern on the first surface closer to one outermost layer.