US Patent No. 10,893,617

MULTILAYER SUBSTRATE AND ANTENNA MODULE


Patent No. 10,893,617
Issue Date January 12, 2021
Title Multilayer Substrate And Antenna Module
Inventorship Saneaki Ariumi, Kyoto (JP)
Assignee MURATA MANUFACTURING CO., LTD., Kyoto (JP)

Claim of US Patent No. 10,893,617

1. A multilayer substrate, comprising: a plurality of insulator layers laminated; and a column conductor extending through two or more of the plurality of insulator layers, wherein the column conductor includes a first via conductor extending through a first insulator layer, a second via conductor extending through a second insulator layer adjacent to the first insulator layer, each of the first via conductor and the second via conductor has a tapered shape in which a cross section decreases from one end portion to another end portion in a lamination direction of the plurality of insulator layers, and the first via conductor and the second via conductor are directly bonded to each other at large diameter portions that are end portions with a large cross section, the multilayer substrate further includes a pattern conductor connected to a small diameter portion of the first via conductor or a small diameter portion of the second via conductor, and a width of the pattern conductor is smaller than a diameter of one, to which the pattern conductor is connected, of the large diameter portion of the first via conductor and the large diameter portion of the second via conductor, and wherein the width of the pattern conductor is smaller than or equal to a diameter of one, to which the pattern conductor is connected, of the small diameter portion of the first via conductor and the small diameter portion of the second via conductor.