US Patent No. 10,893,615

PRINTED CIRCUIT BOARD COMPOSITE AND METHOD FOR PRODUCING SAME


Patent No. 10,893,615
Issue Date January 12, 2021
Title Printed Circuit Board Composite And Method For Producing Same
Inventorship Juergen Rietsch, Wendelstein (DE)
Andreas Plach, Forchheim (DE)
Mathias Strecker, Crailsheim (DE)
Hassene Bel Haj Said, Nuremberg (DE)
Johannes Bock, Hersbruck (DE)
Thengis Greifenstein, Nuremberg (DE)
Assignee CPT Zwei GmbH, Hannover (DE)

Claim of US Patent No. 10,893,615

1. A method for producing a printed circuit board composite, the method comprising:connecting a first printed circuit board, being a sensor carrier printed circuit board, in a form-fitting connection to a second printed circuit board, being a supporting printed circuit board, wherein each of the first and second printed circuit boards have a groove with a groove bottom formed therein, and the first and second printed circuit boards are connected to one another such that the groove bottoms of the grooves fit in and contact one another; and
providing the first printed circuit board with a component and connecting the first and second printed circuit boards to one another such that the second printed circuit board contacts the component and supports the component in position.