1. A manufacturing method for a printed circuit board, comprising:laminating a metal film on an insulating layer, the metal film comprising a first metal layer comprising one or more jagged surface having a roughness formed by peaks between valleys, and a second metal layer comprising a first surface in contact with the first metal layer and a second surface in contact with a surface of the insulating layer;
pressing the metal film toward the insulating layer such that the roughness is transferred to the surface of the insulating layer;
removing the first metal layer such that the first surface of the second metal layer is exposed; and
treating the first surface of the second metal layer with an acidic solution such that at least a portion of the second metal layer is removed from the surface of the insulating layer.