US Patent No. 10,893,613

MANUFACTURING METHOD FOR PRINTED CIRCUIT BOARD


Patent No. 10,893,613
Issue Date January 12, 2021
Title Manufacturing Method For Printed Circuit Board
Inventorship Jong-Guk Kim, Suwon-si (KR)
Chul-Min Lee, Suwon-si (KR)
Sung-Jun Park, Suwon-si (KR)
Dong-Chul Shin, Suwon-si (KR)
Chang-Jae Lee, Suwon-si (KR)
Seon-Hye Kim, Suwon-si (KR)
Joong-Mo Hwang, Suwon-si (KR)
Sim-Hwan Park, Suwon-si (KR)
Myung-Gun Chong, Suwon-si (KR)
Tae-Wook Jung, Suwon-si (KR)
Assignee Samsung Electro-Mechanics Co., Ltd., Suwon-si (KR)

Claim of US Patent No. 10,893,613

1. A manufacturing method for a printed circuit board, comprising:laminating a metal film on an insulating layer, the metal film comprising a first metal layer comprising one or more jagged surface having a roughness formed by peaks between valleys, and a second metal layer comprising a first surface in contact with the first metal layer and a second surface in contact with a surface of the insulating layer;
pressing the metal film toward the insulating layer such that the roughness is transferred to the surface of the insulating layer;
removing the first metal layer such that the first surface of the second metal layer is exposed; and
treating the first surface of the second metal layer with an acidic solution such that at least a portion of the second metal layer is removed from the surface of the insulating layer.