US Patent No. 10,893,603

HEAT DISSIPATION SUBSTRATE, HEAT DISSIPATION CIRCUIT STRUCTURE BODY, AND METHOD FOR MANUFACTURING THE SAME


Patent No. 10,893,603
Issue Date January 12, 2021
Title Heat Dissipation Substrate, Heat Dissipation Circuit Structure Body, And Method For Manufacturing The Same
Inventorship Hiroaki Umeda, Kizugawa (JP)
Kazuhiro Matsuda, Kizugawa (JP)
Ken Yukawa, Kizugawa (JP)
Assignee

Claim of US Patent No. 10,893,603

4. A method for manufacturing a heat dissipation substrate, the method comprising:a process of obtaining a metal laminated body by providing a first metal film on a first surface of a base substrate including the first surface and a second surface;
a process of forming a through-hole penetrating through the metal laminated body from an outer surface of the first metal film of the metal laminated body to the second surface of the base substrate;
a process of achieving a state in which a heat dissipation member is inserted into the through-hole, a part of the heat dissipation member projects from the outer surface of the first metal film, a thermally conductive resin constituent is present, without space, between an inner peripheral surface of the through-hole and the heat dissipation member, and a side surface of the heat dissipation member is covered with the thermally conductive resin constituent;
a process of hardening the thermally conductive resin constituent;
a process of performing machining so that an outer surface of the first metal film, an outer surface of the thermally conductive resin constituent, and an outer surface of the heat dissipation member are disposed on substantially the same plane, wherein the thermally conductive resin constituent comprises at least one of inorganic filler selected from the group consisting of gold powder, silver powder, copper powder, nickel powder, alloy powder including two or more metals selected from gold, silver, copper, and nickel, silver-coated copper powder, gold-coated copper powder, silver-coated nickel powder, gold-coated nickel powder, graphene, and carbon;
a process of forming a second metal film that covers a surface of the first metal film, a surface of the heat dissipation member, and a surface of the thermally conductive resin constituent; and
a process of providing an electrically conductive path and a metal layer covering the outer surface of the heat dissipation member by removing a part of the second metal film to form an arbitrary pattern.