1. A method for producing a power electronics system having a cooling device, a switching device, a terminal device, a capacitor device and a control device, comprising the following production steps:a) providing a cooling device with a plurality of first positioning cutouts and a plurality of second positioning cutouts and said first positioning cutouts and the second positioning cutouts are on a first surface of the cooling device and said first surface is opposite a plurality of extending air-cooled heat sink members;
b) providing the switching device with a substrate and a first mounting device, which has a plurality of first positioning devices, and wherein in the production step b) of providing, the substrate is arranged in a first cutout in the first mounting device, and further comprises conducting a step of fixing the substrate in the first cutout wherein the step of fixing is performed by means of an adhesive electrically insulating material;
c) providing the terminal device with a second mounting device, which has a plurality of second positioning devices;
d) arranging the switching device on the cooling device, wherein the first positioning devices are arranged in respectively assigned first positioning cutouts;
e) arranging the terminal device on the cooling device, wherein the respective second positioning devices are arranged in the respectively assigned second positioning cutouts;
f) positioning the capacitor device on said substrate and said switching device wherein said capacitor device includes a plurality of capacitors and a contact bus bar has a plurality of contact elements extending through second cutouts of the first mounting device for electrically contacting the substrate; and
g) positioning a plurality of load connection elements, for conducting alternating voltage potential, attached to the second mounting device and each said load connection element having a contact area for making simultaneous electrical contact with a respective conductor track of the substrate; and
wherein the first mounting device of the switching device has a second cutout, which opens up a bounded sub-area opening of the substrate on a side remote from the cooling device.