US Patent No. 10,893,601

HEAT DISSIPATION CIRCUIT BOARD


Patent No. 10,893,601
Issue Date January 12, 2021
Title Heat Dissipation Circuit Board
Inventorship Fumiaki Ishikawa, Naka (JP)
Kazuhiko Yamasaki, Naka-gun (JP)
Assignee MITSUBISHI MATERIALS CORPORATION, Tokyo (JP)

Claim of US Patent No. 10,893,601

1. A heat dissipation circuit board comprising:a metal substrate;
an insulating layer which is disposed on at least one surface of the metal substrate; and
a circuit layer which is disposed on a surface of the insulating layer opposite to the metal substrate,
wherein the insulating layer includes a resin formed of a polyimide, a polyamide-imide, or a mixture thereof, and ceramic particles,
the ceramic particles are a mixture of one or two or more kinds selected from silica particles, alumina particles, titanium oxide particles, alumina-doped silica particles, and alumina hydrate particles,
at least some of the ceramic particles form agglomerates, aggregates or a particle assembly,
an amount of the ceramic particles is in a range of 5 vol % to 60 vol %,
a mass average molecular weight of the resin is 100,000 to 500,000,
a specific surface area of the ceramic particles is 50 m2/g to 300 m2/g,
a BET diameter of the ceramic particles is 1 nm to 200 nm,
an average particle diameter of the agglomerates, the aggregates or the particle assembly is 5 times to 100 times the BET diameter, and
the average particle diameter of the agglomerates, the aggregates or the particle assembly is a value of Dv50 measured by a laser diffraction type particle size distribution measuring device in an ultrasonic dispersion state of the ceramic particles in an NMP solvent together with a dispersant.