US Patent No. 10,798,859

COMPONENT MOUNTING METHOD


Patent No. 10,798,859
Issue Date October 06, 2020
Title Component Mounting Method
Inventorship Hideki Sumi, Fukuoka (JP)
Assignee PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD., Osaka (JP)

Claim of US Patent No. 10,798,859

1. A component mounting method in a component mounting apparatus includinga first board transport lane,
a first mounting head,
a second board transport lane which is disposed along the first board transport lane,
a second mounting head,
a first component supplier which is disposed closer to the first board transport lane than to the second board transport lane, and
a second component supplier which is disposed closer to the second board transport lane than to the first board transport lane,
the method comprising:
independent mounting of independently performing
an operation of sucking a component from the first component supplier by the first mounting head, and mounting the component on a first board carried in the first board transport lane, and
an operation of sucking a component from the second component supplier by the second mounting head, and mounting the component on a second board carried in the second board transport lane; and
cross lane alternate mounting of alternately performing
an operation of sucking a component from the second component supplier by the second mounting head, and mounting the component on the first board carried in the first board transport lane, and
an operation of sucking a component from the first component supplier by the first mounting head, and mounting the component on the second board carried in the second board transport lane.