US Patent No. 10,798,847

MODULAR HEAT TRANSFER SYSTEM


Patent No. 10,798,847
Issue Date October 06, 2020
Title Modular Heat Transfer System
Inventorship Michael Aaron Schroeder, Chandler, AZ (US)
Erich Nolan Ewy, Phoenix, AZ (US)
Assignee Intel Corporation, Santa Clara, CA (US)

Claim of US Patent No. 10,798,847

1. An apparatus comprising:a first housing comprising a surface operable to receive heat from a heat-generating component, wherein the first housing includes a first component, a second component, and a third component coupled together to form a cavity to contain a liquid;
a second housing comprising a receptacle operable to receive the first housing, wherein the receptacle is operable to inhibit movement of the first housing along a first axis and facilitate movement of the first housing along a second axis,
wherein the first housing is moveable within the receptacle along the second axis and movement of the first housing along the second axis is operable to change a size of a gap between the surface and the heat-generating component;
a first tube and a second tube connecting the first housing and the second housing, wherein the first and second tubes transfer the liquid in the cavity between the first housing and the second housing; and
a threaded shaft extending between opposing faces of the first housing and the receptacle, wherein the threaded shaft is lockable to fix a position of the first housing along the second axis and to fix the size of the gap.