US Patent No. 10,798,838

RESIN MOLDED PRODUCT, ELECTRONIC DEVICE, MOLD, METHOD FOR MANUFACTURING MOLD AND METHOD FOR MANUFACTURING RESIN MOLDED PRODUCT


Patent No. 10,798,838
Issue Date October 06, 2020
Title Resin Molded Product, Electronic Device, Mold, Method For Manufacturing Mold And Method For Manufacturing Resin Molded Product
Inventorship Kei Oikawa, Kawasaki (JP)
Assignee Canon Kabushiki Kaisha, Tokyo (JP)

Claim of US Patent No. 10,798,838

1. A resin molded product comprising a surface having a hairline pattern in which a plurality of ridges extending in one direction is arranged in a width direction orthogonal to the one direction,wherein the plurality of ridges includes a plurality of first ridges and a plurality of second ridges higher than the first ridges, and
wherein the hairline pattern has a maximum height Ry of 6 [?m] or less in the one direction, and has an arithmetic average curvature Spc of apex points of 625 [1/mm] or lower.