US Patent No. 10,798,829

IMPLEMENTING BACKDRILLING ELIMINATION UTILIZING ANTI-ELECTROPLATE COATING


Patent No. 10,798,829
Issue Date October 06, 2020
Title Implementing Backdrilling Elimination Utilizing Anti-electroplate Coating
Inventorship Matthew S. Doyle, Chatfield, MN (US)
Joseph Kuczynski, North Port, FL (US)
Phillip V. Mann, Rochester, MN (US)
Assignee International Business Machines Corporation, Armonk, NY (US)

Claim of US Patent No. 10,798,829

1. A structure for implementing enhanced via creation during printed circuit board (PCB) manufacturing comprising:a printed circuit board (PCB);
said printed circuit board (PCB) having an internal conductive signal trace;
a single through hole defining a via formed by via drilling, said via having a single uniform diameter extending through the printed circuit board (PCB) and said via extending through the internal conductive signal trace;
an anti-electroplate coating covering the walls of said via spaced below the internal conductive signal trace; said anti-electroplate coating formed of a chemically resistant polymer;
said anti-electroplate coating chemically resistant polymer having a selected thickness of approximately 0.2 ?m;
a via plating formed on walls of said via, said via plating extending above said anti-electroplate coating on walls of said via and extending on walls of said via through and below the internal conductive signal trace; said via plating electrically connected to the internal conductive signal trace; and
said anti-electroplate coating preventing via plating from taking hold in the structure on the walls of said via spaced below the internal conductive signal trace, eliminating via barrel stub creation during PCB manufacturing;
wherein said anti-electroplate coating is applied below a plug in said via, said plug used during printed circuit board (PCB) manufacturing.