US Patent No. 10,798,827

PRINTED CIRCUIT BOARD AND METHOD OF FABRICATING THE SAME


Patent No. 10,798,827
Issue Date October 06, 2020
Title Printed Circuit Board And Method Of Fabricating The Same
Inventorship Yun Mi Bae, Seoul (KR)
Soon Gyu Kwon, Seoul (KR)
Sang Hwa Kim, Seoul (KR)
Sang Young Lee, Seoul (KR)
Jin Hak Lee, Seoul (KR)
Han Su Lee, Seoul (KR)
Dong Hun Jeong, Seoul (KR)
In Ho Jeong, Seoul (KR)
Dae Young Choi, Seoul (KR)
Jung Ho Hwang, Seoul (KR)
Assignee LG INNOTEK CO., LTD., Seoul (KR)

Claim of US Patent No. 10,798,827

1. A printed circuit board comprising:an insulating layer;
a plating seed layer disposed on the insulating layer;
a circuit pattern layer disposed on the plating seed layer and formed of copper (Cu); and
a surface treatment layer disposed on the circuit pattern layer and formed of gold (Au);
wherein the circuit pattern layer comprises:
a first portion contacted with a top surface of the plating seed layer; and
a second portion contacted with a top surface of the first portion and a bottom surface of the surface treatment layer,
wherein the second portion of the circuit pattern layer is formed such that top and bottom surfaces thereof have widths different from each other,
wherein at least one of a left lateral side and a right lateral side of the second portion has a curved surface,
wherein the bottom surface of the surface treatment layer comprises:
a first bottom surface contacted with the second portion of the circuit pattern; and
a second bottom surface spaced apart from the top surface of the second portion of the circuit pattern,
wherein the plating seed layer is formed of Cu,
wherein the plating seed layer is in direct physical contact with the insulating layer, and
wherein the first portion of the circuit pattern layer comprises:
a first area overlapped with the surface treatment layer in a vertical direction; and
a second area not overlapped with the surface treatment layer in the vertical direction.