US Patent No. 10,798,826

POLYIMIDE LAMINATE FILM, METHOD FOR MANUFACTURING POLYIMIDE LAMINATE FILM, METHOD FOR MANUFACTURING THERMOPLASTIC POLYIMIDE, AND METHOD FOR MANUFACTURING FLEXIBLE METAL-CLAD LAMINATE


Patent No. 10,798,826
Issue Date October 06, 2020
Title Polyimide Laminate Film, Method For Manufacturing Polyimide Laminate Film, Method For Manufacturing Thermoplastic Polyimide, And Method For Manufacturing Flexible Metal-clad Laminate
Inventorship Seiji Hosogai, Otsu (JP)
Hiroyuki Ushiro, Otsu (JP)
Junpei Saito, Otsu (JP)
Kazuhiro Ono, Otsu (JP)
Assignee KANEKA CORPORATION, Osaka-shi (JP)

Claim of US Patent No. 10,798,826

1. A polyimide laminated film, comprising:at least one thermoplastic polyimide layer comprising a thermoplastic polyimide that comprises a block (A) having a storage elastic modulus of 0.15 GPa or more at 380° C. and a block (B) having a storage elastic modulus of 0.10 GPa or less at 380° C., and
a non-thermoplastic polyimide film,
wherein the at least one thermoplastic polyimide layer is present on at least one surface of the non-thermoplastic polyimide film,
wherein the block (A) comprises 4,4?-bis (4-aminophenoxy) biphenyl (BAPB), 4,4?-diaminodiphenyl ether (ODA), and 3,3?,4,4?-biphenyltetracarboxylic dianhydride (BPDA),
wherein the block (B) comprises a combination of (i) at least one diamine selected from the group consisting of 2,2?-bis [4-(4-aminophenoxy) phenyl] propane (BAPP) and 4,4?-diaminodiphenyl ether (ODA), and (ii) an acid dianhydride, which is pyromellitic dianhydride (PMDA), and
wherein an amount of the block (A) is from 30 mol % to 70 mol % and an amount of the block (B) is from 30 mol % to 70 mol %, based on a total molar amount of the thermoplastic polyimide.