US Patent No. 10,798,825


Patent No. 10,798,825
Issue Date October 06, 2020
Title Printed Circuit Board
Inventorship Hye-Jin Kim, Suwon-si (KR)
Assignee Samsung Electro-Mechanics Co., Ltd., Suwon-si (KR)

Claim of US Patent No. 10,798,825

1. A printed circuit board comprising:an insulating material; and
a circuit, formed on a surface of the insulating material, comprising
a seed layer formed on the surface of the insulating material,
an anti-reflection layer formed on the seed layer, and
an electroplating layer formed on the anti-reflection layer.