US Patent No. 10,798,824

METHOD FOR MANUFACTURING INSULATED CIRCUIT BOARD, INSULATED CIRCUIT BOARD, AND THERMOELECTRIC CONVERSION MODULE


Patent No. 10,798,824
Issue Date October 06, 2020
Title Method For Manufacturing Insulated Circuit Board, Insulated Circuit Board, And Thermoelectric Conversion Module
Inventorship Nobuyuki Terasaki, Saitama (JP)
Toyo Ohashi, Saitama (JP)
Assignee MITSUBISHI MATERIALS CORPORATION, Tokyo (JP)

Claim of US Patent No. 10,798,824

1. A method for manufacturing an insulated circuit board including a ceramic substrate and a circuit layer having a circuit pattern disposed on one surface of the ceramic substrate,wherein the circuit layer includes an aluminum layer disposed on the one surface of the ceramic substrate, and a titanium layer formed on a surface of the aluminum layer on a side opposite to the ceramic substrate, and
the method comprises:
a ceramic/aluminum-joining step of joining an aluminum material to the ceramic substrate and thereby, forming the aluminum layer;
a titanium material-disposing step of disposing a titanium material, which is to become the titanium layer, on a surface of the aluminum layer or the aluminum material in the circuit pattern shape;
a titanium layer-forming step of performing a heat treatment in a state where the titanium material is laminated on the surface of the aluminum layer or the aluminum material and thereby, forming the titanium layer;
an etching treatment step of etching the aluminum layer on which the titanium layer is formed, into the circuit pattern shape; and
the method further comprises a Si-enriched layer-forming step of forming a Si-enriched layer containing Si in an amount of 0.03 mass % or more and 1.0 mass % or less on the surface of the aluminum layer or the aluminum material on which the titanium layer is to be formed, before the titanium material-disposing step.