1. An electronic module, comprising:a first conductive pattern layer and a first insulating-material layer on at least one surface of the first conductive pattern layer,
at least one opening in the first insulating-material layer that extends through the first insulating-material layer,
a component having contact terminals, the component being arranged at least partially within the opening with its contact terminals electrically coupled to the first conductive pattern layer,
a second insulating-material layer provided on the first insulating-material layer, the component being embedded within the second insulating-material layer such that the second insulating-material layer surrounds the component on at least three sides
a second conductive pattern layer embedded between the first and second insulating-material layers, wherein the component extends through the second conductive pattern layer such that an upper surface of the component is higher than an upper surface of the second conductive pattern layer, and
a third conductive pattern layer on at least one surface of the second insulating-material layer.