US Patent No. 10,798,821

CIRCUIT BOARD HAVING A PASSIVE DEVICE INSIDE A VIA


Patent No. 10,798,821
Issue Date October 06, 2020
Title Circuit Board Having A Passive Device Inside A Via
Inventorship Carlos Gomez, Round Rock, TX (US)
Assignee Intel Corporation, Santa Clara, CA (US)

Claim of US Patent No. 10,798,821

1. A circuit board comprising:a plurality of insulating layers provided in a stack, including a first outermost insulating layer having a top surface of the stack, a second outermost insulating layer having a bottom surface of the stack, and one or more intermediate insulating layers between the first and second outermost insulating layers, the plurality of insulating layers being formed of non-conductive materials;
a via that extends from the top surface of the stack to the bottom surface of the stack; and
a passive device provided in the via, spanning a portion but not an entire length of the via, with a first terminal disposed at a first end of the passive device immediately adjacent to the top surface of the stack, and a second terminal disposed at a second end of the passive device immediately adjacent to a top surface of one of the one or more intermediate insulating layers;
a first connector structure to couple the first terminal of the passive device to a conductive trace on the top surface of the stack, and a second connector structure to couple the second terminal to a conductive trace on the immediately adjacent top surface of the one of intermediate insulating layer; and
a space disposed along a vertical side of the via separating the first and second connector structures.