US Patent No. 10,798,819

FLEXIBLE PRINTED CIRCUIT TO MITIGATE CRACKING AT THROUGH-HOLES


Patent No. 10,798,819
Issue Date October 06, 2020
Title Flexible Printed Circuit To Mitigate Cracking At Through-holes
Inventorship Brian J. Fitzpatrick, McKinney, TX (US)
Jeffrey Cook, Parker, TX (US)
Jitendra Hansalia, Murphy, TX (US)
Amid Ihsan Hashim, Plano, TX (US)
Assignee COMMSCOPE, INC. OF NORTH CAROLINA, Hickory, NC (US)

Claim of US Patent No. 10,798,819

1. A flexible finger for a flexible printed circuit; the flexible finger comprising:(a) a flexible multi-layered construction defining a through-hole in the construction;
the multi-layered construction including,
(i) a flexible substrate having first and second opposing surfaces;
(ii) a conductive trace on the first surface;
(iii) an inner conductive layer on the second surface;
(iv) a first film layer secured to and covering the conductive trace;
(v) a second film layer secured to and covering the inner conductive layer;
(vi) a first conductive outer layer on the first film layer;
(vii) a second conductive outer layer on the second film layer; and
(viii) externally exposed plating lining the through-hole and covering the first conductive outer layer and second conductive outer layer; the plating being limited to a region adjacent to the through-hole, the region having an outer periphery; and
wherein the inner conductive layer, first conductive outer layer, and second conductive outer layer circumscribe the through-hole;
wherein the first conductive outer layer and second conductive outer layer do not extend beyond the outer periphery of the region of the plating; and
wherein the conductive trace in the multi-layered construction is the only functioning conductive trace.