US Patent No. 10,798,814

SIP MODULE AND MANUFACTURING METHOD OF THE SIP MODULE


Patent No. 10,798,814
Issue Date October 06, 2020
Title Sip Module And Manufacturing Method Of The Sip Module
Inventorship Jing Cao, Shanghai (CN)
Weng-Khoon Mong, Shanghai (CN)
Dong-Feng Ling, Shanghai (CN)
Assignee UNIVERSAL SCIENTIFIC INDUSTRIAL (SHANGHAI) CO., LTD., Shanghai (CN)

Claim of US Patent No. 10,798,814

1. A manufacturing method of a system in package (SiP) module, comprising the steps of:welding electronic units required by the SiP module onto a top surface of a Printed Circuit Board (PCB), and having welding spots being reserved on a bottom surface of the PCB to obtain a PCB assembly (PCBA) of the SiP module via a surface mount technology;
pasting tightly a functional film on a surface of the electronic units of the PCBA; filling on plastic materials on the top surface of the PCBA, ensuring that the plastic materials cover the electronic units and the functional film on the top surface of the PCBA, and obtaining solidified PCBA after the plastic materials are solidified; and cutting the solidified PCBA to obtain a plurality of the SiP modules;
applying metal sputtering on a periphery and a top surface of the SiP module to form an electromagnetic shielding layer; andwherein the functional film includes: a plurality of film units being spaced apart from each other by cutting channels, wherein each of the cutting channels is connected to adjacent ones of the film units and is formed with a hollow portion, and wherein each of the film units corresponds to a respective one of the SiP modules.