US Patent No. 10,798,813

PRINTED CIRCUIT BOARD, AIR CONDITIONER, AND METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD


Patent No. 10,798,813
Issue Date October 06, 2020
Title Printed Circuit Board, Air Conditioner, And Method For Manufacturing Printed Circuit Board
Inventorship Tsuyoshi Miura, Tokyo (JP)
Masahiro Koyama, Tokyo (JP)
Assignee Mitsubishi Electric Corporation, Tokyo (JP)

Claim of US Patent No. 10,798,813

1. A printed circuit board comprising:an insulating substrate having a plurality of wiring patterns on a main surface of the insulating substrate;
an electronic component mounted on the main surface of the insulating substrate, the electronic component having a plurality of electrodes required to have insulation distances therebetween, the plurality of electrodes of the electronic component being connected one-to-one to the plurality of wiring patterns; and
a heat-dissipating surface mount component that is a surface mount component mounted to the main surface of the insulating substrate, the heat-dissipating surface mount component being joined via a solder to one of the wiring patterns on the main surface of the insulating substrate to dissipate heat of the wiring pattern, the heat-dissipating surface mount component has a bottom surface entirely joined to only one of the wiring patterns.