US Patent No. 10,772,250

COMPONENT MOUNTING DEVICE AND COMPONENT MOUNTING SYSTEM


Patent No. 10,772,250
Issue Date September 08, 2020
Title Component Mounting Device And Component Mounting System
Inventorship Hiroshi Oike, Chiryu (JP)
Hirotake Esaki, Ichinomiya (JP)
Kenji Sugiyama, Anjo (JP)
Assignee FUJI CORPORATION, Chiryu (JP)

Claim of US Patent No. 10,772,250

1. A component mounting device comprising:a component supply section configured to supply components to be mounted at a specified position of a board;
a pickup nozzle configured to pick up a component supplied by the component supply section;
an imaging section configured to acquire image data by imaging a component picked up by the pickup nozzle;
a memory section configured to save the image data imaged by the imaging section;
a condition determining section configured to determine whether a state of an image imaged by the imaging section satisfies specified conditions for high importance; and
a saving control section configured to, in a case in which it is determined by the condition determining section that the conditions for high importance are satisfied, save the image data imaged by the imaging section on the memory section in a first format that is a lossless compression format, and in a case in which it is determined by the condition determining section that the conditions for high importance are not satisfied, save the image data imaged by the imaging section on the memory section in a second format that is a lossy compression format.