US Patent No. 10,772,245

SYSTEMS AND METHODS FOR THERMAL MANAGEMENT FOR HIGH POWER DENSITY EMI SHIELDED ELECTRONIC DEVICES


Patent No. 10,772,245
Issue Date September 08, 2020
Title Systems And Methods For Thermal Management For High Power Density Emi Shielded Electronic Devices
Inventorship Kevin Craig, Dudley, MA (US)
Assignee CommScope Technologies LLC, Hickory, NC (US)

Claim of US Patent No. 10,772,245

1. An electronic module, the module comprising:a circuit board;
at least one integrated circuit mounted to the circuit board;
at least one electro-magnetic interference (EMI) shield fence mounted to the circuit board, wherein the at least one integrated circuit is mounted within a perimeter defined by the EMI shield fence; and
a heatsink EMI shield lid secured onto the at least one EMI shield fence, wherein the heatsink EMI shield lid seals the at least one integrated circuit within the at least one EMI shield fence in order to inhibit EMI transmissions; and
wherein the heatsink EMI shield lid comprises a spring loaded thermal interface configured to maintain a spring loaded force on, and in conductive thermal contact with, the at least one integrated circuit;
wherein the heatsink EMI shield lid comprises:
an EMI shield lid member having a first surface that interfaces with the at least one EMI shield fence and an opposing second surface comprising a plurality of heatsink fins;
wherein the first surface that interfaces with the at least one EMI shield fence comprises at least one groove aligned with the EMI shield fence, wherein the at least one EMI shield fence is at least partially inserted into the at least one groove.