US Patent No. 10,772,244

HIGH-FREQUENCY MODULE


Patent No. 10,772,244
Issue Date September 08, 2020
Title High-frequency Module
Inventorship Yoshihito Otsubo, Kyoto (JP)
Issei Yamamoto, Kyoto (JP)
Assignee MURATA MANUFACTURING CO., LTD., Kyoto (JP)

Claim of US Patent No. 10,772,244

1. A high-frequency module comprising:a wiring board;
a plurality of components mounted on a principal surface of the wiring board;
a sealing resin layer stacked on the principal surface of the wiring board to seal the plurality of components; and
a shield wall disposed between one or more predetermined components and another one or more components among the plurality of components inside the sealing resin layer,
wherein the shield wall has at least one metal pin standing on the principal surface of the wiring board,
an upper end of the at least one metal pin is exposed from an opposite surface of the sealing resin layer to a surface of the sealing resin layer facing the principal surface of the wiring board,
wherein the shield wall has a metal film filling a groove provided in the sealing resin layer, and a side surface of the metal film is in contact with a side surface of the at least one metal pin, the side surface of the at least one metal pin is connected to the upper end and a lower end of the at least one metal pin,
a height of the metal pin is higher than a height of each of said plurality of components.