US Patent No. 10,772,236


Patent No. 10,772,236
Issue Date September 08, 2020
Title Heat Dissipation Device And Method, And Electronic Device
Inventorship Guowen Zhang, Beijing (CN)
Assignee LENOVO (BEIJING) CO., LTD., Beijing (CN)

Claim of US Patent No. 10,772,236

1. A heat dissipation device, comprising:a heat conducting cover configured to be disposed in an electronic device, the heat conducting cover forming a closed cavity accommodating a heating element of the electronic device, the heat conducting cover comprising a heat conductive shape-memory material, the heat conducting cover configured to deform from a first shape to a second shape after a temperature increases to a first threshold, and configured to restore from the second shape to the first shape after the temperature decreases to a second threshold;
a heat absorbing material filler located within the closed cavity as defined by the heat conducting cover,
wherein, in response to a temperature increase, the heat absorbing material filler is configured to deform structurally, to absorb heat generated by the heating element.