US Patent No. 10,772,228


Patent No. 10,772,228
Issue Date September 08, 2020
Title Sealed Package Including Electronic Device And Power Source
Inventorship John K Day, Chandler, AZ (US)
Michael J Nidelkoff, White Bear Lake, MN (US)
Kris A Peterson, Minneapolis, MN (US)
Andrew J Ries, Lino Lakes, MN (US)
David A Ruben, Mesa, AZ (US)
Craig L Wiklund, Bloomington, MN (US)
Assignee Medtronic, Inc., Minneapolis, MN (US)

Claim of US Patent No. 10,772,228

1. A hermetically-sealed package, comprising:a housing comprising an inner surface, an outer surface, and a cavity;
a non-conductive substrate comprising a first major surface and a second major surface, wherein the non-conductive substrate is substantially transparent;
an electronic device disposed on the first major surface of the substrate and comprising a device contact;
a power source disposed at least partially within the cavity of the housing and comprising a resilient power source contact; and
an electrode disposed on the second major surface of the substrate, wherein the electrode is electrically connected to the electronic device by a via formed between the first major surface and the second major surface of the substrate;
wherein the substrate is hermetically sealed to the housing by a laser bond such that a non-bonded electrical connection is formed within the cavity of the housing between the device contact and the resilient power source contact.